JPH0260063B2 - - Google Patents

Info

Publication number
JPH0260063B2
JPH0260063B2 JP60098293A JP9829385A JPH0260063B2 JP H0260063 B2 JPH0260063 B2 JP H0260063B2 JP 60098293 A JP60098293 A JP 60098293A JP 9829385 A JP9829385 A JP 9829385A JP H0260063 B2 JPH0260063 B2 JP H0260063B2
Authority
JP
Japan
Prior art keywords
layer
gaas
mesfet
active layer
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60098293A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61256675A (ja
Inventor
Shigeru Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP60098293A priority Critical patent/JPS61256675A/ja
Priority to US06/860,425 priority patent/US4717685A/en
Priority to DE8686106310T priority patent/DE3686089T2/de
Priority to EP86106310A priority patent/EP0201873B1/en
Publication of JPS61256675A publication Critical patent/JPS61256675A/ja
Publication of JPH0260063B2 publication Critical patent/JPH0260063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • H01L21/26546—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds of electrically active species
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • H01L21/26546—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds of electrically active species
    • H01L21/26553—Through-implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • H01L21/2656—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds characterised by the implantation of both electrically active and inactive species in the same semiconductor region to be doped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/051—Manufacture or treatment of FETs having PN junction gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/945—Special, e.g. metal

Landscapes

  • Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
JP60098293A 1985-05-09 1985-05-09 シヨツトキゲ−ト電界効果トランジスタの製造方法 Granted JPS61256675A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60098293A JPS61256675A (ja) 1985-05-09 1985-05-09 シヨツトキゲ−ト電界効果トランジスタの製造方法
US06/860,425 US4717685A (en) 1985-05-09 1986-05-07 Method for producing a metal semiconductor field effect transistor
DE8686106310T DE3686089T2 (de) 1985-05-09 1986-05-09 Verfahren zur herstellung eines metall-halbleiter-feldeffekttransistors und dadurch hergestellter transistor.
EP86106310A EP0201873B1 (en) 1985-05-09 1986-05-09 A method of the production of a metal semiconductor field effect transistor and said transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60098293A JPS61256675A (ja) 1985-05-09 1985-05-09 シヨツトキゲ−ト電界効果トランジスタの製造方法

Publications (2)

Publication Number Publication Date
JPS61256675A JPS61256675A (ja) 1986-11-14
JPH0260063B2 true JPH0260063B2 (en]) 1990-12-14

Family

ID=14215875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60098293A Granted JPS61256675A (ja) 1985-05-09 1985-05-09 シヨツトキゲ−ト電界効果トランジスタの製造方法

Country Status (4)

Country Link
US (1) US4717685A (en])
EP (1) EP0201873B1 (en])
JP (1) JPS61256675A (en])
DE (1) DE3686089T2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251505A (ja) * 2009-04-15 2010-11-04 Toyota Motor Corp 窒化物半導体装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4889817A (en) * 1985-08-08 1989-12-26 Oki Electric Industry Co., Ltd. Method of manufacturing schottky gate field transistor by ion implantation method
US4847550A (en) * 1987-01-16 1989-07-11 Hitachi, Ltd. Semiconductor circuit
EP0437702B1 (en) * 1989-11-21 1998-08-12 Fujitsu Limited Semiconductor integrated circuit of compound semiconductor devices comprising isolation regions and method of making the same
US5276340A (en) * 1989-11-21 1994-01-04 Fujitsu Limited Semiconductor integrated circuit having a reduced side gate effect
US5183767A (en) * 1991-02-14 1993-02-02 International Business Machines Corporation Method for internal gettering of oxygen in iii-v compound semiconductors
US5272373A (en) * 1991-02-14 1993-12-21 International Business Machines Corporation Internal gettering of oxygen in III-V compound semiconductors
US5453630A (en) * 1992-11-12 1995-09-26 The United States Of America As Represented By The Secretary Of The Army Variable gain optical detector
KR0144821B1 (ko) * 1994-05-16 1998-07-01 양승택 저전원전압으로 작동가능한 갈륨비소 반도체 전력소자의 제조 방법
US5411902A (en) * 1994-06-06 1995-05-02 The United States Of America As Represented By The Secretary Of The Air Force Process for improving gallium arsenide field effect transistor performance using an aluminum arsenide or an aluminum gallium arsenide buffer layer
US6458640B1 (en) * 2001-06-04 2002-10-01 Anadigics, Inc. GaAs MESFET having LDD and non-uniform P-well doping profiles
US6830953B1 (en) * 2002-09-17 2004-12-14 Taiwan Semiconductor Manufacturing Company, Ltd. Suppression of MOSFET gate leakage current
US7485514B2 (en) * 2006-01-05 2009-02-03 Winslow Thomas A Method for fabricating a MESFET
JP5601848B2 (ja) * 2010-02-09 2014-10-08 三菱電機株式会社 ＳｉＣ半導体装置の製造方法
CN106910775B (zh) * 2017-03-20 2020-01-10 西安电子科技大学 一种具有多凹陷缓冲层的4H-SiC金属半导体场效应晶体管
FR3104808A1 (fr) * 2019-12-12 2021-06-18 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé de réalisation d'une couche semiconductrice dopée

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3901738A (en) * 1973-12-20 1975-08-26 Hughes Aircraft Co Ion implanted junction laser and process for making same
JPS55151349A (en) * 1979-05-15 1980-11-25 Matsushita Electronics Corp Forming method of insulation isolating region
JPS5633817A (en) * 1979-08-29 1981-04-04 Fujitsu Ltd Preparation of semiconductor device
US4389768A (en) * 1981-04-17 1983-06-28 International Business Machines Corporation Self-aligned process for fabricating gallium arsenide metal-semiconductor field effect transistors
EP0112657B1 (en) * 1982-11-29 1990-06-20 Fujitsu Limited Field effect transistor and process for fabricating it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251505A (ja) * 2009-04-15 2010-11-04 Toyota Motor Corp 窒化物半導体装置

Also Published As

Publication number Publication date
DE3686089T2 (de) 1993-01-07
EP0201873B1 (en) 1992-07-22
US4717685A (en) 1988-01-05
EP0201873A2 (en) 1986-11-20
DE3686089D1 (de) 1992-08-27
JPS61256675A (ja) 1986-11-14
EP0201873A3 (en) 1989-10-18

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